Thermal Contact Conductance

• Main Author: Madhusudana, Chakravarti V. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2014.
• Edition: 2nd ed. 2014.
• Series: Mechanical Engineering Series,
• Subjects: Engineering.; Thermodynamics.; Heat engineering.; Heat transfer.; Mass transfer.; Engineering Thermodynamics, Heat and Mass Transfer.

This book covers both theoretical and practical aspects of thermal contact conductance. The theoretical discussion focuses on heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae an...

Table of Contents:

• Introduction
• Thermal Constriction Resistance
• Solid Spot Thermal Conductance of a Joint
• Gap Conductance at the Interface.-Experimental Aspects
• Special Configurations and Processes
• Control of Thermal Contact Conductance Using Interstitial Materials and Coatings
• Major Applications
• Additional Topics
• Concluding Remarks.