Noia, B., & Chakrabarty, K. (2014). Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Springer International Publishing : Imprint: Springer.
Chicago Style (17th ed.) CitationNoia, Brandon, and Krishnendu Chakrabarty. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Cham: Springer International Publishing : Imprint: Springer, 2014.
MLA (8th ed.) CitationNoia, Brandon, and Krishnendu Chakrabarty. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Springer International Publishing : Imprint: Springer, 2014.
Warning: These citations may not always be 100% accurate.