Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge res...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς:	Noia, Brandon (Συγγραφέας), Chakrabarty, Krishnendu (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	English
Έκδοση:	Cham : Springer International Publishing : Imprint: Springer, 2014.
Θέματα:	Engineering. Microprocessors. Semiconductors. Electronic circuits. Circuits and Systems. Processor Architectures.
Διαθέσιμο Online:	Full Text via HEAL-Link

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3D Stacked Chips From Emerging Processes to Heterogeneous Systems /
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The Boundary-Scan Handbook
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Exploring Memory Hierarchy Design with Emerging Memory Technologies
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Dynamic Reconfigurable Architectures and Transparent Optimization Techniques Automatic Acceleration of Software Execution /
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Automatic Analog IC Sizing and Optimization Constrained with PVT Corners and Layout Effects
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Computer-Aided Design of Microfluidic Very Large Scale Integration (mVLSI) Biochips Design Automation, Testing, and Design-for-Testability /
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High Quality Test Pattern Generation and Boolean Satisfiability
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Έκδοση: (2012)

Pipelined ADC Design and Enhancement Techniques
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Modeling, Analysis and Optimization of Network-on-Chip Communication Architectures
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Spintronics-based Computing
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More-than-Moore 2.5D and 3D SiP Integration
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Functional Verification of Dynamically Reconfigurable FPGA-based Systems
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
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Έκδοση: (2013)

System-Level Validation High-Level Modeling and Directed Test Generation Techniques /
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Multi-Net Optimization of VLSI Interconnect
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Formal Specification Level Concepts, Methods, and Algorithms /
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Model-Driven Design Using IEC 61499 A Synchronous Approach for Embedded and Automation Systems /
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Application Analysis Tools for ASIP Design Application Profiling and Instruction-set Customization /
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Reconfigurable Networks-on-Chip
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Self-Organization in Embedded Real-Time Systems
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Design Technology for Heterogeneous Embedded Systems
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Hardware/Software Co-design for Heterogeneous Multi-core Platforms The hArtes Toolchain /
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Network-on-Chip Architectures A Holistic Design Exploration /
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Analog Circuit Design Smart Data Converters, Filters on Chip, Multimode Transmitters /
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Debugging at the Electronic System Level
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Ultra-Low Energy Domain-Specific Instruction-Set Processors
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Multimedia Multiprocessor Systems Analysis, Design and Management /
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Protecting Chips Against Hold Time Violations Due to Variability
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Έκδοση: (2014)

Designing TSVs for 3D Integrated Circuits
ανά: Khan, Nauman, κ.ά.
Έκδοση: (2013)

Techniques for Building Timing-Predictable Embedded Systems
ανά: Guan, Nan
Έκδοση: (2016)

Arbitrary Modeling of TSVs for 3D Integrated Circuits
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3D Video Coding for Embedded Devices Energy Efficient Algorithms and Architectures /
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Fuzzy Logic Based Power-Efficient Real-Time Multi-Core System
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SVA: The Power of Assertions in SystemVerilog
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