Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς:	Salah, Khaled (Συγγραφέας), Ismail, Yehea (Συγγραφέας), El-Rouby, Alaa (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή:	SpringerLink (Online service)
Μορφή:	Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:	English
Έκδοση:	Cham : Springer International Publishing : Imprint: Springer, 2015.
Σειρά:	Analog Circuits and Signal Processing,
Θέματα:	Engineering. Microprocessors. Electronics. Microelectronics. Electronic circuits. Circuits and Systems. Electronics and Microelectronics, Instrumentation. Processor Architectures.
Διαθέσιμο Online:	Full Text via HEAL-Link

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Multi-Net Optimization of VLSI Interconnect
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