Arbitrary Modeling of TSVs for 3D Integrated Circuits

• Main Authors: Salah, Khaled (Author), Ismail, Yehea (Author), El-Rouby, Alaa (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
• Series: Analog Circuits and Signal Processing,
• Subjects: Engineering.; Microprocessors.; Electronics.; Microelectronics.; Electronic circuits.; Circuits and Systems.; Electronics and Microelectronics, Instrumentation.; Processor Architectures.

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth...

Table of Contents:

• Introduction: Work around Moore’s Law
• 3D/TSV Enabling Technologies
• TSV Modeling and Analysis
• TSV Verification
• TSV Macro-Modeling Framework
• TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter
• Imperfection in TSV Modeling
• New Trends in TSV
• TSV Fabrication
• Conclusions.