Παραπομπή σε μορφή APA (7η εκδ.)

SpringerLink (Online service), Kondo, K., Kada, M., & Takahashi, K. (2015). Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications (1st ed. 2015.). Springer International Publishing : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

SpringerLink (Online service), Kazuo Kondo, Morihiro Kada, και Kenji Takahashi. Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications. 1st ed. 2015. Cham: Springer International Publishing : Imprint: Springer, 2015.

Παραπομπή σε μορφή MLA (8th εκδ.)

SpringerLink (Online service), et al. Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications. 1st ed. 2015. Springer International Publishing : Imprint: Springer, 2015.

Πρόσοχή: Οι παραπομπές μπορεί να μην είναι 100% ακριβείς.