Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Kada, Morihiro (Επιμελητής έκδοσης), Takahashi, Kenji (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2015.
• Έκδοση: 1st ed. 2015.
• Θέματα: Chemistry.; Electrochemistry.; Semiconductors.; Mechanical engineering.; Electrical engineering.; Biomedical engineering.; Electrical Engineering.; Mechanical Engineering.; Biomedical Engineering.
• Φυσική περιγραφή: XIX, 408 p. 460 illus., 269 illus. in color. online resource.
• ISBN: 9783319186757

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.