Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kondo, Kazuo (Editor), Kada, Morihiro (Editor), Takahashi, Kenji (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
• Edition: 1st ed. 2015.
• Subjects: Chemistry.; Electrochemistry.; Semiconductors.; Mechanical engineering.; Electrical engineering.; Biomedical engineering.; Electrical Engineering.; Mechanical Engineering.; Biomedical Engineering.
• Physical Description: XIX, 408 p. 460 illus., 269 illus. in color. online resource.
• ISBN: 9783319186757

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.