Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Kada, Morihiro (Επιμελητής έκδοσης), Takahashi, Kenji (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2015.
Έκδοση:1st ed. 2015.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 02824nam a22005415i 4500
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020 |a 9783319186757  |9 978-3-319-18675-7 
024 7 |a 10.1007/978-3-319-18675-7  |2 doi 
040 |d GrThAP 
050 4 |a QD551-578 
072 7 |a PNRH  |2 bicssc 
072 7 |a SCI013050  |2 bisacsh 
082 0 4 |a 541.37  |2 23 
245 1 0 |a Three-Dimensional Integration of Semiconductors  |h [electronic resource] :  |b Processing, Materials, and Applications /  |c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. 
250 |a 1st ed. 2015. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2015. 
300 |a XIX, 408 p. 460 illus., 269 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET. 
520 |a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 
650 0 |a Chemistry. 
650 0 |a Electrochemistry. 
650 0 |a Semiconductors. 
650 0 |a Mechanical engineering. 
650 0 |a Electrical engineering. 
650 0 |a Biomedical engineering. 
650 1 4 |a Chemistry. 
650 2 4 |a Electrochemistry. 
650 2 4 |a Electrical Engineering. 
650 2 4 |a Semiconductors. 
650 2 4 |a Mechanical Engineering. 
650 2 4 |a Biomedical Engineering. 
700 1 |a Kondo, Kazuo.  |e editor. 
700 1 |a Kada, Morihiro.  |e editor. 
700 1 |a Takahashi, Kenji.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783319186740 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-18675-7  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)