Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Kondo, Kazuo (Επιμελητής έκδοσης), Kada, Morihiro (Επιμελητής έκδοσης), Takahashi, Kenji (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2015.
Έκδοση:1st ed. 2015.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Πίνακας περιεχομένων:
  • Research and Development History of Three Dimensional (3D) Integration Technology
  • Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
  • TSV Processes
  • Wafer and Die Bonding Processes
  • Metrology and Inspection
  • TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
  • Trends in 3D Integrated Circuit (3D-IC) Testing Technology
  • Dream Chip Project at ASET.