Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...
Συγγραφή απο Οργανισμό/Αρχή: | |
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Άλλοι συγγραφείς: | , , |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Cham :
Springer International Publishing : Imprint: Springer,
2015.
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Έκδοση: | 1st ed. 2015. |
Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Research and Development History of Three Dimensional (3D) Integration Technology
- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
- TSV Processes
- Wafer and Die Bonding Processes
- Metrology and Inspection
- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
- Trends in 3D Integrated Circuit (3D-IC) Testing Technology
- Dream Chip Project at ASET.