Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kondo, Kazuo (Editor), Kada, Morihiro (Editor), Takahashi, Kenji (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
• Edition: 1st ed. 2015.
• Subjects: Chemistry.; Electrochemistry.; Semiconductors.; Mechanical engineering.; Electrical engineering.; Biomedical engineering.; Electrical Engineering.; Mechanical Engineering.; Biomedical Engineering.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

Table of Contents:

• Research and Development History of Three Dimensional (3D) Integration Technology
• Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
• TSV Processes
• Wafer and Die Bonding Processes
• Metrology and Inspection
• TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
• Trends in 3D Integrated Circuit (3D-IC) Testing Technology
• Dream Chip Project at ASET.