Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications /

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next g...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Kondo, Kazuo (Editor), Kada, Morihiro (Editor), Takahashi, Kenji (Editor)
Format: Electronic eBook
Language:English
Published: Cham : Springer International Publishing : Imprint: Springer, 2015.
Edition:1st ed. 2015.
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ΒΚΠ - Πατρα: ALFd

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Call Number: 330.01 BAU
Copy 1 Available

ΒΚΠ - Πατρα: BSC

Holdings details from ΒΚΠ - Πατρα: BSC
Call Number: 330.01 BAU
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