Heat Transfer and Pressure Drop in Flow Boiling in Microchannels

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro chann...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Saha, Sujoy Kumar (Συγγραφέας), Celata, Gian Piero (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2016.
Σειρά:SpringerBriefs in Applied Sciences and Technology,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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020 |a 9783319202853  |9 978-3-319-20285-3 
024 7 |a 10.1007/978-3-319-20285-3  |2 doi 
040 |d GrThAP 
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100 1 |a Saha, Sujoy Kumar.  |e author. 
245 1 0 |a Heat Transfer and Pressure Drop in Flow Boiling in Microchannels  |h [electronic resource] /  |c by Sujoy Kumar Saha, Gian Piero Celata. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2016. 
300 |a X, 55 p. 40 illus., 16 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a SpringerBriefs in Applied Sciences and Technology,  |x 2191-530X 
505 0 |a 1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research. 
520 |a This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to “Critical Heat Flux in Flow Boiling in Micro channels,” by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling. 
650 0 |a Engineering. 
650 0 |a Fluids. 
650 0 |a Thermodynamics. 
650 0 |a Heat engineering. 
650 0 |a Heat transfer. 
650 0 |a Mass transfer. 
650 0 |a Fluid mechanics. 
650 1 4 |a Engineering. 
650 2 4 |a Engineering Thermodynamics, Heat and Mass Transfer. 
650 2 4 |a Engineering Fluid Dynamics. 
650 2 4 |a Fluid- and Aerodynamics. 
700 1 |a Celata, Gian Piero.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783319202846 
830 0 |a SpringerBriefs in Applied Sciences and Technology,  |x 2191-530X 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-20285-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)