Advances in Heat Transfer Enhancement

Advances in Heat Transfer Enhancement

This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς: Saha, Sujoy Kumar (Συγγραφέας), Tiwari, Manvendra (Συγγραφέας), Sundén, Bengt (Συγγραφέας), Wu, Zan (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2016.
Θέματα:
Engineering.
Thermodynamics.
Heat engineering.
Heat transfer.
Mass transfer.
Fluid mechanics.
Automotive engineering.
Building construction.
Engineering Thermodynamics, Heat and Mass Transfer.
Engineering Fluid Dynamics.
Automotive Engineering.
Building Physics, HVAC.
Διαθέσιμο Online:Full Text via HEAL-Link
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100 1 |a Saha, Sujoy Kumar.  |e author. 
245 1 0 |a Advances in Heat Transfer Enhancement  |h [electronic resource] /  |c by Sujoy Kumar Saha, Manvendra Tiwari, Bengt Sundén, Zan Wu. 
264 1 |a Cham :  |b Springer International Publishing :  |b Imprint: Springer,  |c 2016. 
300 |a VIII, 129 p. 91 illus., 53 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Principles of enhanced heat transfer -- The enhancement techniques, commercial applications, potential for -- enhancement, heat transfer fundamentals -- Performance evaluation criteria for single and two-phase heat exchangers -- Plate and fin extended surfaces, externally and internally finned tubes, insert -- devices, integral roughness -- Enhancement of boiling and condensation heat transfer. 
520 |a This Brief addresses the phenomena of heat transfer enhancement. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including “Critical Heat Flux in Flow Boiling in Microchannels,” this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling. 
650 0 |a Engineering. 
650 0 |a Thermodynamics. 
650 0 |a Heat engineering. 
650 0 |a Heat transfer. 
650 0 |a Mass transfer. 
650 0 |a Fluid mechanics. 
650 0 |a Automotive engineering. 
650 0 |a Building construction. 
650 1 4 |a Engineering. 
650 2 4 |a Engineering Thermodynamics, Heat and Mass Transfer. 
650 2 4 |a Engineering Fluid Dynamics. 
650 2 4 |a Thermodynamics. 
650 2 4 |a Automotive Engineering. 
650 2 4 |a Building Physics, HVAC. 
700 1 |a Tiwari, Manvendra.  |e author. 
700 1 |a Sundén, Bengt.  |e author. 
700 1 |a Wu, Zan.  |e author. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783319294780 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-29480-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647) 

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