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03559nam a22004695i 4500 |
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978-3-319-29746-0 |
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160709s2017 gw | s |||| 0|eng d |
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|a 9783319297460
|9 978-3-319-29746-0
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|a 10.1007/978-3-319-29746-0
|2 doi
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|d GrThAP
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|a TK7888.4
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|a TJFC
|2 bicssc
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|a TEC008010
|2 bisacsh
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|a 621.3815
|2 23
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|a Carbon Nanotubes for Interconnects
|h [electronic resource] :
|b Process, Design and Applications /
|c edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
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|a Cham :
|b Springer International Publishing :
|b Imprint: Springer,
|c 2017.
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300 |
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|a XII, 333 p. 167 illus., 133 illus. in color.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
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|a text file
|b PDF
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|a Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
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|a This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
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650 |
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|a Engineering.
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650 |
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|a Microprocessors.
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650 |
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|a Electronic circuits.
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4 |
|a Engineering.
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650 |
2 |
4 |
|a Circuits and Systems.
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650 |
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4 |
|a Processor Architectures.
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650 |
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|a Electronic Circuits and Devices.
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700 |
1 |
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|a Todri-Sanial, Aida.
|e editor.
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700 |
1 |
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|a Dijon, Jean.
|e editor.
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700 |
1 |
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|a Maffucci, Antonio.
|e editor.
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710 |
2 |
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|a SpringerLink (Online service)
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773 |
0 |
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|t Springer eBooks
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776 |
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8 |
|i Printed edition:
|z 9783319297446
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856 |
4 |
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|u http://dx.doi.org/10.1007/978-3-319-29746-0
|z Full Text via HEAL-Link
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912 |
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|a ZDB-2-ENG
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950 |
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|a Engineering (Springer-11647)
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