Carbon Nanotubes for Interconnects Process, Design and Applications /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Todri-Sanial, Aida (Editor), Dijon, Jean (Editor), Maffucci, Antonio (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Subjects: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Electronic Circuits and Devices.

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...

Table of Contents:

• Interconnect challenges for 2D and 3D Integration
• Overview of Carbon Nanotube Physical Properties
• Overview of Carbon Nanotube Processing Methods
• Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization
• Computational Studies of Thermal Transport Properties of Carbon Nanotube Material
• Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects
• Carbon Nanotubes as Vertical Interconnects for 3D ICs
• Carbon Nanotubes as Micro-Bumps for 3D Integration
• Electrothermal Modeling of Carbon Nanotubes TSVs
• Exploring Carbon Nanotubes for 3D Power Delivery Networks
• Carbon Nanotubes for Monolithic 3D ICs.