Carbon Nanotubes for Interconnects Process, Design and Applications /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Todri-Sanial, Aida (Editor), Dijon, Jean (Editor), Maffucci, Antonio (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Subjects: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Processor Architectures.; Electronic Circuits and Devices.

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...