Computational Studies in Organometallic Chemistry

The series Structure and Bonding publishes critical Reviews on Topics of Research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new an...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Macgregor, Stuart A. (Επιμελητής έκδοσης), Eisenstein, Odile (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2016.
Έκδοση:1st ed. 2016.
Σειρά:Structure and Bonding, 167
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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245 1 0 |a Computational Studies in Organometallic Chemistry  |h [electronic resource] /  |c edited by Stuart A. Macgregor, Odile Eisenstein. 
250 |a 1st ed. 2016. 
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300 |a VII, 181 p.  |b online resource. 
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490 1 |a Structure and Bonding,  |x 0081-5993 ;  |v 167 
505 0 |a D10-ML2 Complexes: Structure, Bonding and Catalytic Activity -- Computation of Excited States of Transition Metal Complexes -- Reactivities and Electronic Properties of Boryl Ligands -- QM/MM studies in Organometallic Chemistry -- Dynamic Studies in Organometallic Chemistry -- CH activation, from transition metal to main group systems -- Computation and experiment into alignment in Organometallic Chemistry: Are we there. 
520 |a The series Structure and Bonding publishes critical Reviews on Topics of Research concerned with chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant. The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. 
650 0 |a Chemistry. 
650 0 |a Inorganic chemistry. 
650 0 |a Organometallic chemistry. 
650 0 |a Chemistry, Physical and theoretical. 
650 1 4 |a Chemistry. 
650 2 4 |a Organometallic Chemistry. 
650 2 4 |a Theoretical and Computational Chemistry. 
650 2 4 |a Inorganic Chemistry. 
700 1 |a Macgregor, Stuart A.  |e editor. 
700 1 |a Eisenstein, Odile.  |e editor. 
710 2 |a SpringerLink (Online service) 
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830 0 |a Structure and Bonding,  |x 0081-5993 ;  |v 167 
856 4 0 |u http://dx.doi.org/10.1007/978-3-319-31638-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)