Materials for Advanced Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lu, Daniel (Επιμελητής έκδοσης), Wong, C.P (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Έκδοση: 2nd ed. 2017.
• Θέματα: Engineering.; Nanotechnology.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Nanotechnology and Microengineering.; Metallic Materials.; Optical and Electronic Materials.; Circuits and Systems.

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...

Πίνακας περιεχομένων:

• 3D Integration Technologies – An Overview
• Advanced Bonding/Joining Techniques
• Advanced Chip-to-Substrate Connections
• Advanced Wire Bonding Technology: Materials, Methods, and Testing
• Lead-Free Soldering
• Thin Die Fabrication and Applications to Wafer Level System Integration
• Advanced Substrates: A Materials and Processing Perspective
• Flip-Chip Underfill: Materials, Process and Reliability
• New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
• Electrically Conductive Adhesives (ECAs)
• Die Attach Adhesives and Films
• Thermal Interface Materials
• Embedded Passives
• Advanced Bonding Technology Based on Nano- and Micro-metal Pastes
• Wafer Level Chip Scale Packaging
• MEMS Packaging
• LED Die Bonding
• Medical Electronics Design, Manufacturing, and Reliability
• Flexible and Printed Electronics
• Silicon Solar Cell Metallization Pastes
• Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices
• Characterization of Copper Diffusion in Through Silicon Vias.