Materials for Advanced Packaging

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Lu, Daniel (Επιμελητής έκδοσης), Wong, C.P (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Έκδοση: 2nd ed. 2017.
• Θέματα: Engineering.; Nanotechnology.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Nanotechnology and Microengineering.; Metallic Materials.; Optical and Electronic Materials.; Circuits and Systems.

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...