Materials for Advanced Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Lu, Daniel (Editor), Wong, C.P (Editor)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Edition: 2nd ed. 2017.
• Subjects: Engineering.; Nanotechnology.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Metals.; Electronics and Microelectronics, Instrumentation.; Nanotechnology and Microengineering.; Metallic Materials.; Optical and Electronic Materials.; Circuits and Systems.

This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D p...