More-than-Moore 2.5D and 3D SiP Integration
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business a...
Κύριος συγγραφέας: | Radojcic, Riko (Συγγραφέας) |
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Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Cham :
Springer International Publishing : Imprint: Springer,
2017.
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Παρόμοια τεκμήρια
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More than Moore Technologies for Next Generation Computer Design
Έκδοση: (2015) -
Testing of Interposer-Based 2.5D Integrated Circuits
ανά: Wang, Ran, κ.ά.
Έκδοση: (2017) -
Designing TSVs for 3D Integrated Circuits
ανά: Khan, Nauman, κ.ά.
Έκδοση: (2013) -
3D Stacked Chips From Emerging Processes to Heterogeneous Systems /
Έκδοση: (2016) -
Arbitrary Modeling of TSVs for 3D Integrated Circuits
ανά: Salah, Khaled, κ.ά.
Έκδοση: (2015)