More-than-Moore 2.5D and 3D SiP Integration

• Main Author: Radojcic, Riko (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Subjects: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Processor Architectures.

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business a...

Table of Contents:

• Introduction
• More-than-Moore Technology Opportunities: 2.5D SiP
• More-than-Moore Technology Opportunities: 3D SiP
• More-than-Moore Design Eco-System
• More-than-Moore Adoption Landscape.