More-than-Moore 2.5D and 3D SiP Integration

• Κύριος συγγραφέας: Radojcic, Riko (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
• Θέματα: Engineering.; Microprocessors.; Electronic circuits.; Circuits and Systems.; Electronic Circuits and Devices.; Processor Architectures.

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business a...

Πίνακας περιεχομένων:

• Introduction
• More-than-Moore Technology Opportunities: 2.5D SiP
• More-than-Moore Technology Opportunities: 3D SiP
• More-than-Moore Design Eco-System
• More-than-Moore Adoption Landscape.