Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

• Main Author: Yazdani, Farhang (Author, http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2018.
• Edition: 1st ed. 2018.
• Subjects: Electronic circuits.; Electronics.; Microelectronics.; Circuits and Systems.; Electronic Circuits and Devices.; Electronics and Microelectronics, Instrumentation.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips an...

Table of Contents:

• Introduction
• Wirebond Physical Implementation
• Flip-Chip Physical Implementation
• Substrate Physical Implementation
• Conventional Design Flow
• Pathfinding and Co-Design.