System Level Design from HW/SW to Memory for Embedded Systems 5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, Foz do Iguaçu, Brazil, November 3-6, 2015, Proceedings /

This book constitutes the refereed proceedings of the 5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, held in Foz do Iguaçu, Brazil, in November 2015. The 18 full revised papers presented were carefully reviewed and selected from 25 submissions. The papers present a broad discus...

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Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Götz, Marcelo (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Schirner, Gunar (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Wehrmeister, Marco Aurélio (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Al Faruque, Mohammad Abdullah (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt), Rettberg, Achim (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2017.
Έκδοση:1st ed. 2017.
Σειρά:IFIP Advances in Information and Communication Technology, 523
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
Περιγραφή
Περίληψη:This book constitutes the refereed proceedings of the 5th IFIP TC 10 International Embedded Systems Symposium, IESS 2015, held in Foz do Iguaçu, Brazil, in November 2015. The 18 full revised papers presented were carefully reviewed and selected from 25 submissions. The papers present a broad discussion on the design, analysis and verification of embedded and cyber-physical systems including design methodologies, verification, performance analysis, and real-time systems design. They are organized in the following topical sections: cyber-physical systems, system-level design; multi/many-core system design; memory system design; and embedded HW/SW design and applications.
Φυσική περιγραφή:XII, 231 p. 92 illus. online resource.
ISBN:9783319900230
ISSN:1868-4238 ;
DOI:10.1007/978-3-319-90023-0