Nanopackaging Nanotechnologies and Electronics Packaging /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Morris, James E. (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2018.
• Έκδοση: 2nd ed. 2018.
• Θέματα: Nanotechnology.; Electronics.; Microelectronics.; Electrochemistry.; Electronics and Microelectronics, Instrumentation.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials ar...

Πίνακας περιεχομένων:

• Nanopackaging: Nanotechnologies and Electronics Packaging
• Modelling Technologies and Applications
• Advances in Delamination Modeling: Continuum Aspects
• Advances in Delamination Modeling: Atomistic Aspects
• Soft Mold Nano-imprint: Modeling and Simulation
• Nanoparticle Properties
• Nanoparticle Fabrication
• Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors
• Nanostructured Materials for Embedded Resistors
• Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging
• Nanoparticles in Isotropic Conductive Adhesives
• Nano materials in Anisotropic Conductive Adhesives (ACAs)
• Nanoparticles in Microvias
• Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging
• A Study of Nano Particles in SnAg-Based Lead Free Solders
• Nano-Underfills for Fine Pitch Electronics
• Carbon Nanotubes: Synthesis and Characterization
• Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications
• High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes
• Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes
• Carbon Nanotubes for Thermal Management of Microsystems
• Nanowires in Electronics Packaging
• Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection
• Synthesis and Optical Characterization of CVD Graphene
• Characterization of electronic, electrical, optical and mechanical properties of grapheme
• Graphene for Thermal Cooling of Microelectronics
• Carbon Interconnects
• Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
• Nanosensors for Electronics Package Reliability
• Applications of Bio-Nanotechnology to Electronics Packaging
• Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
• Nanotechnology Health, Safety, Environment Overview.