Lifelong Technology-Enhanced Learning 13th European Conference on Technology Enhanced Learning, EC-TEL 2018, Leeds, UK, September 3-5, 2018, Proceedings /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Pammer-Schindler, Viktoria (Editor, http://id.loc.gov/vocabulary/relators/edt), Pérez-Sanagustín, Mar (Editor, http://id.loc.gov/vocabulary/relators/edt), Drachsler, Hendrik (Editor, http://id.loc.gov/vocabulary/relators/edt), Elferink, Raymond (Editor, http://id.loc.gov/vocabulary/relators/edt), Scheffel, Maren (Editor, http://id.loc.gov/vocabulary/relators/edt)
• Format: Electronic eBook
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2018.
• Edition: 1st ed. 2018.
• Series: Information Systems and Applications, incl. Internet/Web, and HCI ; 11082
• Subjects: Education-Data processing.; Application software.; Artificial intelligence.; Data mining.; Mathematical logic.; Computers and Education.; Computer Appl. in Social and Behavioral Sciences.; Artificial Intelligence.; Data Mining and Knowledge Discovery.; Information Systems Applications (incl. Internet).; Mathematical Logic and Formal Languages.
• Physical Description: XXIII, 667 p. 290 illus., 133 illus. in color. online resource.
• ISBN: 9783319985725
• DOI: 10.1007/978-3-319-98572-5

This book constitutes the proceedings of the 13th European Conference on Technology Enhanced Learning, EC-TEL 2018, held in Leeds, UK, in September 2018. The 42 full and short papers, 7 demo papers, and 23 poster papers presented in this volume were carefully reviewed and selected from 142 submissions. This year, the European Conference on Technology-Enhanced Learning (EC-TEL) will engage researchers, practitioners, educational developers, entrepreneurs and policy makers in a joint discussion on how to put science, technology and practice at the service of learning to embrace these challenges on the topic: Lifelong technology enhanced learning: Dealing with the complexity of 21st century challenges. Chapter "" is available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.