SpringerLink (Online service) & Siow, K. S. (2019). Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability (1st ed. 2019.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-319-99256-3
Παραπομπή σε μορφή Chicago (17η εκδ.)SpringerLink (Online service) και Kim S. Siow. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. 1st ed. 2019. Cham: Springer International Publishing : Imprint: Springer, 2019. https://doi.org/10.1007/978-3-319-99256-3.
Παραπομπή σε μορφή MLA (8th εκδ.)SpringerLink (Online service) και Kim S. Siow. Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. 1st ed. 2019. Springer International Publishing : Imprint: Springer, 2019. https://doi.org/10.1007/978-3-319-99256-3.
