Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability /

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Siow, Kim S. (Επιμελητής έκδοσης, http://id.loc.gov/vocabulary/relators/edt)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Cham : Springer International Publishing : Imprint: Springer, 2019.
• Έκδοση: 1st ed. 2019.
• Θέματα: Optical materials.; Electronic materials.; Electronics.; Microelectronics.; Metals.; Materials science.; Engineering-Materials.; Quality control.; Reliability.; Industrial safety.; Optical and Electronic Materials.; Electronics and Microelectronics, Instrumentation.; Metallic Materials.; Characterization and Evaluation of Materials.; Materials Engineering.; Quality Control, Reliability, Safety and Risk.

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and...

Πίνακας περιεχομένων:

• Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison
• Chapter 2: Sintered Silver for LED Applications
• Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications
• Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials
• Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint
• Chapter6: Morphological changes in sintered silver due to atomic migration
• Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials
• Chapter 8: Sintered Copper : Chemistry, Process and Reliability
• Chapter 9: Transient Liquid Phase Bonding
• Chapter 10: Die attach materials for extreme conditions and harsh environments.