Force Sensors for Microelectronic Packaging Applications

• Κύριοι συγγραφείς: Schwizer, Jürg (Συγγραφέας), Mayer, Michael (Συγγραφέας), Brand, Oliver (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg, 2005.
• Σειρά: Microtechnology and MEMS,
• Θέματα: Materials science.; Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Nanotechnology.; Materials Science.; Optical and Electronic Materials.; Engineering, general.; Quality Control, Reliability, Safety and Risk.; Electronics and Microelectronics, Instrumentation.

 This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging. 

 Sensor Design -- Measurement System -- Characterization -- Applications -- Conclusions and Outlook.