Force Sensors for Microelectronic Packaging Applications
This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...
Κύριοι συγγραφείς: | , , |
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Συγγραφή απο Οργανισμό/Αρχή: | |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Berlin, Heidelberg :
Springer Berlin Heidelberg,
2005.
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Σειρά: | Microtechnology and MEMS,
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Sensor Design
- Measurement System
- Characterization
- Applications
- Conclusions and Outlook.