Force Sensors for Microelectronic Packaging Applications

• Κύριοι συγγραφείς: Schwizer, Jürg (Συγγραφέας), Mayer, Michael (Συγγραφέας), Brand, Oliver (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg, 2005.
• Σειρά: Microtechnology and MEMS,
• Θέματα: Materials science.; Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Nanotechnology.; Materials Science.; Optical and Electronic Materials.; Engineering, general.; Quality Control, Reliability, Safety and Risk.; Electronics and Microelectronics, Instrumentation.

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...

Πίνακας περιεχομένων:

• Sensor Design
• Measurement System
• Characterization
• Applications
• Conclusions and Outlook.