Force Sensors for Microelectronic Packaging Applications

• Main Authors: Schwizer, Jürg (Author), Mayer, Michael (Author), Brand, Oliver (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Berlin, Heidelberg : Springer Berlin Heidelberg, 2005.
• Series: Microtechnology and MEMS,
• Subjects: Materials science.; Engineering.; Quality control.; Reliability.; Industrial safety.; Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Nanotechnology.; Materials Science.; Optical and Electronic Materials.; Engineering, general.; Quality Control, Reliability, Safety and Risk.; Electronics and Microelectronics, Instrumentation.

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging proc...