Modeling of Adhesively Bonded Joints

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: da Silva, Lucas Filipe Martins (Επιμελητής έκδοσης), Öchsner, Andreas (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg, 2008.
• Θέματα: Engineering.; Continuum mechanics.; Structural mechanics.; Industrial engineering.; Production engineering.; Materials science.; Continuum Mechanics and Mechanics of Materials.; Structural Mechanics.; Industrial and Production Engineering.; Materials Science, general.
• Φυσική περιγραφή: X, 335 p. online resource.
• ISBN: 9783540790563

A lot of recent developments have been made about adhesively bonded joints modeling using various methods of analysis. The increasing application of adhesives in industry is partly due to the increased sophistication and reliability of adhesive joints modeling. The book proposed intends to provide the designer with the most advanced stress analyses techniques in adhesive joints to reinforce the use of this promising bonding technique.