Low Pressure Plasmas and Microstructuring Technology

This monograph presents an up to date perspective of gas discharge physics and its applications to various industries. It starts from a comprehensive overview of the different types to generate plasmas by DC discharges, capacitive and inductive radiofrequency coupling, helicon waves including electr...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Franz, Gerhard (Συγγραφέας)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg, 2009.
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 03743nam a22005655i 4500
001 978-3-540-85849-2
003 DE-He213
005 20151204175514.0
007 cr nn 008mamaa
008 100301s2009 gw | s |||| 0|eng d
020 |a 9783540858492  |9 978-3-540-85849-2 
024 7 |a 10.1007/978-3-540-85849-2  |2 doi 
040 |d GrThAP 
050 4 |a TA1750-1750.22 
072 7 |a TJFD  |2 bicssc 
072 7 |a TEC021000  |2 bisacsh 
072 7 |a TEC008080  |2 bisacsh 
082 0 4 |a 620.11295  |2 23 
082 0 4 |a 620.11297  |2 23 
100 1 |a Franz, Gerhard.  |e author. 
245 1 0 |a Low Pressure Plasmas and Microstructuring Technology  |h [electronic resource] /  |c by Gerhard Franz. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg,  |c 2009. 
300 |a XXIV, 732 p. 422 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
505 0 |a Collisions and cross sections -- The plasma -- DC discharges -- High-frequency discharges I -- High-frequency discharges II -- High-frequency discharges III -- Ion beam systems -- Plasma diagnostics -- Plasma deposition processes -- Plasma etch processes -- Etch Mechanisms -- Outlook -- Advanced Topics. 
520 |a This monograph presents an up to date perspective of gas discharge physics and its applications to various industries. It starts from a comprehensive overview of the different types to generate plasmas by DC discharges, capacitive and inductive radiofrequency coupling, helicon waves including electron cyclotron resonance, and ion beams. To compare these theories with inert plasmas, a fundamental description of plasma diagnostics is presented on the basis of four prominent methods and extended to reactive plasmas.The second part extensively deals with the interaction of these plasmas with surfaces in order to coat or to etch them with reactive gases. Main topics are sputtering, plasma-enhanced chemical vapor deposition, and reactive ion etching. The difficulties which had to be overcome to reach the next technological node in the semiconductor map are documented by a long row of microfeatures. These processes and corresponding microscopic mechanisms are discussed in the final section of this part. In the concluding third part, various fundamental derivations are minutely extended which are required for a deep understanding of the plasma processes. In retrospect, the semiconductor industry has triggered the development of new methods to excite plasmas. But it was now the industrial part to operate these plasmas with reactive gases. As a result of this combined effort, surface modifications with plasmas are now in widespread use even in low-cost applications due to its easy and convenient implantation as well as its favorable environmental impact. 
650 0 |a Materials science. 
650 0 |a Atomic structure. 
650 0 |a Molecular structure. 
650 0 |a Spectra. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 0 |a Optical materials. 
650 0 |a Electronic materials. 
650 0 |a Materials  |x Surfaces. 
650 0 |a Thin films. 
650 1 4 |a Materials Science. 
650 2 4 |a Optical and Electronic Materials. 
650 2 4 |a Electronics and Microelectronics, Instrumentation. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
650 2 4 |a Atomic/Molecular Structure and Spectra. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783540858485 
856 4 0 |u http://dx.doi.org/10.1007/978-3-540-85849-2  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)