Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules /

• Main Author: Fischer-Hirchert, Ulrich H. P. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2015.
• Subjects: Engineering.; Nanotechnology.; Microwaves.; Optical engineering.; Electronic circuits.; Microwaves, RF and Optical Engineering.; Nanotechnology and Microengineering.; Circuits and Systems.

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find...

Table of Contents:

• Introduction into Photonic Packaging
• Optical waveguides
• Optical Mode Field Adaptation
• Fiber-chip-coupling
• RF Lines
• Soldering, Adhesive Bonding, Bonding
• Optical Coneection Technology
• Active Adjustment Techniques
• Passive Adjustment Techniques
• Optical Motherboard
• Fiber-Optic Modules
• From Chip Design to the Optimum Package
• Reliability Tests
• Abbreviations
• Index.