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03164nam a22004935i 4500 |
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978-3-642-28522-6 |
| 003 |
DE-He213 |
| 005 |
20151125201359.0 |
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cr nn 008mamaa |
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120716s2012 gw | s |||| 0|eng d |
| 020 |
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|a 9783642285226
|9 978-3-642-28522-6
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7 |
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|a 10.1007/978-3-642-28522-6
|2 doi
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|d GrThAP
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|a T174.7
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|a TA418.9.N35
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|a TBN
|2 bicssc
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|a TEC027000
|2 bisacsh
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|a SCI050000
|2 bisacsh
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|a 620.115
|2 23
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|a Bio and Nano Packaging Techniques for Electron Devices
|h [electronic resource] :
|b Advances in Electronic Device Packaging /
|c edited by Gerald Gerlach, Klaus-Jürgen Wolter.
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| 264 |
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1 |
|a Berlin, Heidelberg :
|b Springer Berlin Heidelberg :
|b Imprint: Springer,
|c 2012.
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| 300 |
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|a XII, 628 p.
|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
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|a text file
|b PDF
|2 rda
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|a General Aspects -- 3D Modelling and Design for Nems -- Nanoparticles -- Nanopatterning -- Metallization -- Nano- and Bio-Functionalized Surfaces -- Biocompatible Packaging -- Thermal Management -- System-In-Package For Mems and Moems.
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| 520 |
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|a The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.
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| 650 |
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0 |
|a Materials science.
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| 650 |
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0 |
|a Optical materials.
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| 650 |
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0 |
|a Electronic materials.
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| 650 |
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0 |
|a Nanotechnology.
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| 650 |
1 |
4 |
|a Materials Science.
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| 650 |
2 |
4 |
|a Nanotechnology.
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| 650 |
2 |
4 |
|a Optical and Electronic Materials.
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| 650 |
2 |
4 |
|a Characterization and Evaluation of Materials.
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| 700 |
1 |
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|a Gerlach, Gerald.
|e editor.
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| 700 |
1 |
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|a Wolter, Klaus-Jürgen.
|e editor.
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| 710 |
2 |
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|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer eBooks
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| 776 |
0 |
8 |
|i Printed edition:
|z 9783642285219
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| 856 |
4 |
0 |
|u http://dx.doi.org/10.1007/978-3-642-28522-6
|z Full Text via HEAL-Link
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| 912 |
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|a ZDB-2-CMS
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| 950 |
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|a Chemistry and Materials Science (Springer-11644)
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