Design of Adhesive Joints Under Humid Conditions

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Άλλοι συγγραφείς: Silva, Lucas F. M. da (Επιμελητής έκδοσης), Sato, Chiaki (Επιμελητής έκδοσης)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Σειρά:Advanced Structured Materials, 25
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
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245 1 0 |a Design of Adhesive Joints Under Humid Conditions  |h [electronic resource] /  |c edited by Lucas F. M. da Silva, Chiaki Sato. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2013. 
300 |a VII, 182 p.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
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490 1 |a Advanced Structured Materials,  |x 1869-8433 ;  |v 25 
505 0 |a Diffusion of moisture in adhesives -- Diffusion of moisture in interfaces -- Surface treatments for moisture resistance -- Influence of moisture on the adhesive properties -- Influence of water on the interface properties -- Prediction of joint strength under humid conditions: Continuum mechanics approach -- Prediction of joint strength under humid conditions: Fracture mechanics approach -- Prediction of joint strength under humid conditions: Damage mechanics approach. 
520 |a This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted. 
650 0 |a Materials science. 
650 0 |a Polymers. 
650 0 |a Continuum mechanics. 
650 0 |a Aerospace engineering. 
650 0 |a Astronautics. 
650 0 |a Materials  |x Surfaces. 
650 0 |a Thin films. 
650 1 4 |a Materials Science. 
650 2 4 |a Surfaces and Interfaces, Thin Films. 
650 2 4 |a Continuum Mechanics and Mechanics of Materials. 
650 2 4 |a Polymer Sciences. 
650 2 4 |a Aerospace Technology and Astronautics. 
700 1 |a Silva, Lucas F. M. da.  |e editor. 
700 1 |a Sato, Chiaki.  |e editor. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9783642376139 
830 0 |a Advanced Structured Materials,  |x 1869-8433 ;  |v 25 
856 4 0 |u http://dx.doi.org/10.1007/978-3-642-37614-6  |z Full Text via HEAL-Link 
912 |a ZDB-2-CMS 
950 |a Chemistry and Materials Science (Springer-11644)