Design of Adhesive Joints Under Humid Conditions

• Corporate Author: SpringerLink (Online service)
• Other Authors: Silva, Lucas F. M. da (Editor), Sato, Chiaki (Editor)
• Format: Electronic eBook
• Language: English
• Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
• Series: Advanced Structured Materials, 25
• Subjects: Materials science.; Polymers.; Continuum mechanics.; Aerospace engineering.; Astronautics.; Materials > Surfaces.; Thin films.; Materials Science.; Surfaces and Interfaces, Thin Films.; Continuum Mechanics and Mechanics of Materials.; Polymer Sciences.; Aerospace Technology and Astronautics.

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

Table of Contents:

• Diffusion of moisture in adhesives
• Diffusion of moisture in interfaces
• Surface treatments for moisture resistance
• Influence of moisture on the adhesive properties
• Influence of water on the interface properties
• Prediction of joint strength under humid conditions: Continuum mechanics approach
• Prediction of joint strength under humid conditions: Fracture mechanics approach
• Prediction of joint strength under humid conditions: Damage mechanics approach.