Παραπομπή σε μορφή APA (7η εκδ.)

Zhang, Q. (2016). Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Berlin Heidelberg : Imprint: Springer.

Παραπομπή σε μορφή Chicago (17η εκδ.)

Zhang, Qingke. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Berlin, Heidelberg: Springer Berlin Heidelberg : Imprint: Springer, 2016.

Παραπομπή σε μορφή MLA (8th εκδ.)

Zhang, Qingke. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Berlin Heidelberg : Imprint: Springer, 2016.