APA (7th ed.) Citation

Zhang, Q. (2016). Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Berlin Heidelberg : Imprint: Springer.

Chicago Style (17th ed.) Citation

Zhang, Qingke. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Berlin, Heidelberg: Springer Berlin Heidelberg : Imprint: Springer, 2016.

MLA (8th ed.) Citation

Zhang, Qingke. Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Berlin Heidelberg : Imprint: Springer, 2016.