Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2016.
|
| Series: | Springer Theses, Recognizing Outstanding Ph.D. Research,
|
| Subjects: | |
| Online Access: | Full Text via HEAL-Link |
