Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

• Κύριος συγγραφέας: Zhang, Qingke (Συγγραφέας)
• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016.
• Σειρά: Springer Theses, Recognizing Outstanding Ph.D. Research,
• Θέματα: Engineering.; Structural mechanics.; Materials science.; Materials > Surfaces.; Thin films.; Structural Mechanics.; Surfaces and Interfaces, Thin Films.; Classical Mechanics.; Characterization and Evaluation of Materials.

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...

Πίνακας περιεχομένων:

• Research Progress in Pb-free Soldering
• Fracture Behavior of IMCs at Cu/Pb-free Solder Interface
• Tensile-compress Fatigue Behavior of Solder Joints
• Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints
• Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints
• Conclusions.