Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

• Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
• Άλλοι συγγραφείς: Gusev, Evgeni (Επιμελητής έκδοσης), Garfunkel, Eric (Επιμελητής έκδοσης), Dideikin, Arthur (Επιμελητής έκδοσης)
• Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
• Γλώσσα: English
• Έκδοση: Dordrecht : Springer Netherlands, 2010.
• Σειρά: NATO Science for Peace and Security Series B: Physics and Biophysics,
• Θέματα: Materials science.; Biotechnology.; Mechanics.; Nanotechnology.; Control engineering.; Robotics.; Mechatronics.; Electronics.; Microelectronics.; Metals.; Materials Science.; Metallic Materials.; Control, Robotics, Mechatronics.; Electronics and Microelectronics, Instrumentation.; Microengineering.; Nanotechnology and Microengineering.

A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific iss...

Πίνακας περιεχομένων:

• MEMS/NEMS Technologies and Applications
• History of Early Research on MEMS in Russia (U.S.S.R.)
• Challenges of Complete CMOS/MEMS Systems Integration
• MEMS for Practical Applications
• Nanochip: A MEMS-Based Ultra-High Data Density Memory Device
• Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU
• Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors
• Monocrystalline-Silicon Microwave MEMS Devices
• Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites
• MEMS Device and Reliability Physics
• Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams
• Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS
• The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches
• Advanced Processes and Materials
• Development of DRIE for the Next Generation of MEMS Devices
• Low-Temperature Processes for MEMS Device Fabrication
• High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications
• 3D Integration of MEMS and IC: Design, Technology and Simulations
• Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices
• Modeling of Dry Etching in Production of MEMS
• XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures
• Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys
• Sensors
• Smart Sensors: Advantages and Pitfalls
• Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents
• Integration of Diverse Biological Materials in Micro/Nano Devices
• Force Sensing Optimization and Applications
• Using Parametric Resonance to Improve Micro Gyrsocope Robustness.