APA (7th ed.) Citation

Cheng, J., & Cheng, J. (2018). Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (1st ed. 2018.). Springer Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-10-6165-3

Chicago Style (17th ed.) Citation

Cheng, Jie, and Jie Cheng. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Singapore: Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-6165-3.

MLA (8th ed.) Citation

Cheng, Jie, and Jie Cheng. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-6165-3.