Παραπομπή σε μορφή APA (7η εκδ.)

Cheng, J., & Cheng, J. (2018). Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (1st ed. 2018.). Springer Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-10-6165-3

Παραπομπή σε μορφή Chicago (17η εκδ.)

Cheng, Jie, και Jie Cheng. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Singapore: Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-6165-3.

Παραπομπή σε μορφή MLA (8th εκδ.)

Cheng, Jie, και Jie Cheng. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-6165-3.