Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Cheng, Jie (Συγγραφέας, http://id.loc.gov/vocabulary/relators/aut)
Συγγραφή απο Οργανισμό/Αρχή: SpringerLink (Online service)
Μορφή: Ηλεκτρονική πηγή Ηλ. βιβλίο
Γλώσσα:English
Έκδοση: Singapore : Springer Singapore : Imprint: Springer, 2018.
Έκδοση:1st ed. 2018.
Σειρά:Springer Theses, Recognizing Outstanding Ph.D. Research,
Θέματα:
Διαθέσιμο Online:Full Text via HEAL-Link
LEADER 02911nam a2200529 4500
001 978-981-10-6165-3
003 DE-He213
005 20191026081215.0
007 cr nn 008mamaa
008 170908s2018 si | s |||| 0|eng d
020 |a 9789811061653  |9 978-981-10-6165-3 
024 7 |a 10.1007/978-981-10-6165-3  |2 doi 
040 |d GrThAP 
050 4 |a TS1-2301 
072 7 |a TGP  |2 bicssc 
072 7 |a TEC020000  |2 bisacsh 
072 7 |a TGP  |2 thema 
082 0 4 |a 670  |2 23 
100 1 |a Cheng, Jie.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect   |h [electronic resource] /  |c by Jie Cheng. 
250 |a 1st ed. 2018. 
264 1 |a Singapore :  |b Springer Singapore :  |b Imprint: Springer,  |c 2018. 
300 |a XVIII, 137 p. 103 illus.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a text file  |b PDF  |2 rda 
490 1 |a Springer Theses, Recognizing Outstanding Ph.D. Research,  |x 2190-5053 
520 |a This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research. 
650 0 |a Manufactures. 
650 0 |a Tribology. 
650 0 |a Corrosion and anti-corrosives. 
650 0 |a Coatings. 
650 0 |a Electronics. 
650 0 |a Microelectronics. 
650 1 4 |a Manufacturing, Machines, Tools, Processes.  |0 http://scigraph.springernature.com/things/product-market-codes/T22050 
650 2 4 |a Tribology, Corrosion and Coatings.  |0 http://scigraph.springernature.com/things/product-market-codes/Z15000 
650 2 4 |a Electronics and Microelectronics, Instrumentation.  |0 http://scigraph.springernature.com/things/product-market-codes/T24027 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer eBooks 
776 0 8 |i Printed edition:  |z 9789811061646 
776 0 8 |i Printed edition:  |z 9789811061660 
776 0 8 |i Printed edition:  |z 9789811355851 
830 0 |a Springer Theses, Recognizing Outstanding Ph.D. Research,  |x 2190-5053 
856 4 0 |u https://doi.org/10.1007/978-981-10-6165-3  |z Full Text via HEAL-Link 
912 |a ZDB-2-ENG 
950 |a Engineering (Springer-11647)