Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

• Main Author: Cheng, Jie (Author, http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2018.
• Edition: 1st ed. 2018.
• Series: Springer Theses, Recognizing Outstanding Ph.D. Research,
• Subjects: Manufactures.; Tribology.; Corrosion and anti-corrosives.; Coatings.; Electronics.; Microelectronics.; Manufacturing, Machines, Tools, Processes.; Tribology, Corrosion and Coatings.; Electronics and Microelectronics, Instrumentation.

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...