Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...
Κύριος συγγραφέας: | Cheng, Jie (Συγγραφέας, http://id.loc.gov/vocabulary/relators/aut) |
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Συγγραφή απο Οργανισμό/Αρχή: | SpringerLink (Online service) |
Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
Γλώσσα: | English |
Έκδοση: |
Singapore :
Springer Singapore : Imprint: Springer,
2018.
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Έκδοση: | 1st ed. 2018. |
Σειρά: | Springer Theses, Recognizing Outstanding Ph.D. Research,
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Θέματα: | |
Διαθέσιμο Online: | Full Text via HEAL-Link |
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