APA (7th ed.) Citation

Lau, J. H., & Lau, J. H. (2018). Fan-Out Wafer-Level Packaging (1st ed. 2018.). Springer Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-10-8884-1

Chicago Style (17th ed.) Citation

Lau, John H., and John H. Lau. Fan-Out Wafer-Level Packaging. 1st ed. 2018. Singapore: Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-8884-1.

MLA (8th ed.) Citation

Lau, John H., and John H. Lau. Fan-Out Wafer-Level Packaging. 1st ed. 2018. Springer Singapore : Imprint: Springer, 2018. https://doi.org/10.1007/978-981-10-8884-1.