Fan-Out Wafer-Level Packaging

• Main Author: Lau, John H. (Author, http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2018.
• Edition: 1st ed. 2018.
• Subjects: Electronic circuits.; Nanotechnology.; Optical materials.; Electronic materials.; Circuits and Systems.; Nanotechnology and Microengineering.; Optical and Electronic Materials.

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...

Table of Contents:

• Patent Issues of Fan-out Wafer-Level Packaging
• Flip Chip Technology vs. FOWLP
• Fan-In Wafer-Level Packaging vs. FOWLP
• Embedded Chip Packaging
• FOWLP: Chip-First and Die Face-Down
• FOWLP: Chip-First and Die Face-Up
• FOWLP: Chip-Last or RDL-First
• FOWLP: PoP with FOWLP
• Fan-Out Panel-Level Packaging (FOPLP)
• 3D Integration
• Heterogeneous Integration.