Παραπομπή σε μορφή APA (7η εκδ.)

Huang, Y., Yin, Z., & Wan, X. (2019). Modeling and Application of Flexible Electronics Packaging (1st ed. 2019.). Springer Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-13-3627-0

Παραπομπή σε μορφή Chicago (17η εκδ.)

Huang, YongAn, Zhouping Yin, και Xiaodong Wan. Modeling and Application of Flexible Electronics Packaging. 1st ed. 2019. Singapore: Springer Singapore : Imprint: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.

Παραπομπή σε μορφή MLA (8th εκδ.)

Huang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. 1st ed. 2019. Springer Singapore : Imprint: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.