Modeling and Application of Flexible Electronics Packaging

• Main Authors: Huang, YongAn (Author, http://id.loc.gov/vocabulary/relators/aut), Yin, Zhouping (http://id.loc.gov/vocabulary/relators/aut), Wan, Xiaodong (http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2019.
• Edition: 1st ed. 2019.
• Subjects: Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Manufactures.; Mechanics.; Mechanics, Applied.; Computer simulation.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Manufacturing, Machines, Tools, Processes.; Theoretical and Applied Mechanics.; Simulation and Modeling.
• Physical Description: XVII, 287 p. online resource.
• ISBN: 9789811336270
• DOI: 10.1007/978-981-13-3627-0

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.