Modeling and Application of Flexible Electronics Packaging

• Main Authors: Huang, YongAn (Author, http://id.loc.gov/vocabulary/relators/aut), Yin, Zhouping (http://id.loc.gov/vocabulary/relators/aut), Wan, Xiaodong (http://id.loc.gov/vocabulary/relators/aut)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic eBook
• Language: English
• Published: Singapore : Springer Singapore : Imprint: Springer, 2019.
• Edition: 1st ed. 2019.
• Subjects: Electronics.; Microelectronics.; Optical materials.; Electronic materials.; Manufactures.; Mechanics.; Mechanics, Applied.; Computer simulation.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Manufacturing, Machines, Tools, Processes.; Theoretical and Applied Mechanics.; Simulation and Modeling.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...